Pay in 4 interest-free payments of $1875.00 Learn more
Ships within 48 hours · Estimated delivery Sep 4 - Sep 9
40% less LCO2 consumption
carrier power and gated video measurements
LINDBERG/BLUE M HTF55667C 1200°C Split Hinge
Temperature range -73°C to +200°C
True independent X
Tresky T-3000-HF High Force Flip Chip Bonder Hot Deal 40% less LCO2 consumptionTresky T 3000 HF High Force Flip Chip Bonder TRESKY T 3000 HF flip chip bonder is used for the epoxy dispensing and stamping, samples alignment (2 m accuracy), heating and compression to enable interconnecting devices. The bonder is capable of 20 g to 50 kg pressure, 360 die spindle rotation range, 200 mm X and Y motion range. The system is equipped with tool and substrate heat up to 400 C. Samples are aligned via HDMI camera.
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